GAL22V10-25LNC — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

GAL22V10-25LNC: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: +0.0 TO 75.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-390-6604, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

GAL22V10-25LNC

NSN: 5962-01-390-6604
NIINs: 013906604, 013908333, 013972750
FSC: 5962 — Microcircuits, Electronic
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

features_provided	PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	25.00 NANOSECONDS MAXIMUM ACCESS NS
voltage_rating_and_type_per_characteristic	7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-390-6604

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	+0.0 TO 75.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is GAL22V10-25LNC?

GAL22V10-25LNC is a MICROCIRCUIT,MEMORY.

What parts can replace GAL22V10-25LNC?

There is 1 known substitute for GAL22V10-25LNC: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for GAL22V10-25LNC?

GAL22V10-25LNC is cataloged in the U.S. Government catalog under NSN 5962-01-390-6604. This indicates validated use in U.S. government and defense supply chains.

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