G70810-00: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.450 INCHES NOMINAL IN, body_height: 0.060 INCHES NOMINAL IN, body_length: 0.450 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-225-9116, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.450 INCHES NOMINAL IN |
| body_height | 0.060 INCHES NOMINAL IN |
| body_length | 0.450 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 7 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 28 LEADLESS |
| NSN | 5962-01-225-9116 |
| INPUT CIRCUIT PATTERN | 7 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 COUNTER |
| BODY WIDTH | 0.450 INCHES NOMINAL IN |
| BODY HEIGHT | 0.060 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| BODY LENGTH | 0.450 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |