G553507-220 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G553507-220: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.890 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN, body_height: 0.350 INCHES MAXIMUM IN, body_length: 2.375 INCHES MINIMUM AND 2.425 INCHES MAXIMUM IN, special_features: ALTERED ITEM MADE FROM G526560-1/BURN FILE P/N BFG553507-220, features_provided: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-483-1971, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G553507-220

NSN: 5962-01-483-1971
FSC: 5962 — Microcircuits, Electronic
CAGE: 49956 — RAYTHEON COMPANY DIV CORP (USA)

SPECIFICATIONS

body_width	0.890 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
body_height	0.350 INCHES MAXIMUM IN
body_length	2.375 INCHES MINIMUM AND 2.425 INCHES MAXIMUM IN
special_features	ALTERED ITEM MADE FROM G526560-1/BURN FILE P/N BFG553507-220
features_provided	MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	CP-2237/SPS-4, OLIVER PERRY CLASS FFG
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-483-1971

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

BODY WIDTH: 0.890 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.350 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 2.375 INCHES MINIMUM AND 2.425 INCHES MAXIMUM IN

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
BODY WIDTH	0.890 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
BODY HEIGHT	0.350 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	2.375 INCHES MINIMUM AND 2.425 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
SPECIAL FEATURES	ALTERED ITEM MADE FROM G526560-1/BURN FILE P/N BFG553507-220
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT

SUBSTITUTES & CROSS-REFERENCES 1

G553507Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is G553507-220?

G553507-220 is a MICROCIRCUIT,MEMORY.

What parts can replace G553507-220?

There is 1 known substitute for G553507-220: G553507. Substitute compatibility should be verified for your specific system.

What is the NSN for G553507-220?

G553507-220 is cataloged in the U.S. Government catalog under NSN 5962-01-483-1971. This indicates validated use in U.S. government and defense supply chains.

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