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G371570-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

G371570-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, memory_device_type: PAL, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., end_item_identification: SATELLITE COMMUNICATIONS TERMINAL AN/USC-38(V)1, inclosure_configuration: FLAT PACK, terminal_type_and_quantity: 14 FLAT LEADS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-351-4958, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
G371570-1
NSN: 5962-01-351-4958
NIINs: 013514958, 013514959, 014549990
FSC: 5962 — Microcircuits, Electronic
CAGE: 49956 — RAYTHEON COMPANY DIV CORP (USA)
SPECIFICATIONS
features_providedPROGRAMMED
memory_device_typePAL
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
end_item_identificationSATELLITE COMMUNICATIONS TERMINAL AN/USC-38(V)1
inclosure_configurationFLAT PACK
terminal_type_and_quantity14 FLAT LEADS
part_name_assigned_by_controlling_agencyFUSED PAL
NSN5962-01-351-4958
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN G371570-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: PROGRAMMED
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: PAL
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDPROGRAMMED
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEPAL
PART NAME ASSIGNED BY CONTROLLING AGENCYFUSED PAL
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
END ITEM IDENTIFICATIONSATELLITE COMMUNICATIONS TERMINAL AN/USC-38(V)1
TERMINAL TYPE AND QUANTITY14 FLAT LEADS
SUBSTITUTES & CROSS-REFERENCES 3
G437398-2Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
PRG437398-2Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is G371570-1?
G371570-1 is a MICROCIRCUIT,MEMORY.
What parts can replace G371570-1?
There are 3 known substitutes for G371570-1: G437398-2, PRG437398-2, ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for G371570-1?
G371570-1 is cataloged in the U.S. Government catalog under NSN 5962-01-351-4958. This indicates validated use in U.S. government and defense supply chains.
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