G371371-102 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G371371-102: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, special_features: ALTERED ITEM MADE FROM G339348-2;CAGEC 49956;HCI;ESD;PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-358-6216, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G371371-102

NSN: 5962-01-358-6216
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.200 INCHES MAXIMUM IN
body_length	1.280 INCHES MAXIMUM IN
special_features	ALTERED ITEM MADE FROM G339348-2;CAGEC 49956;HCI;ESD;PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	MILSTAR
inclosure_configuration	DUAL-IN-LINE
terminal_type_and_quantity	24 FLAT LEADS
NSN	5962-01-358-6216

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

•

BODY LENGTH: 1.280 INCHES MAXIMUM IN

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.280 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURES	ALTERED ITEM MADE FROM G339348-2;CAGEC 49956;HCI;ESD;PROGRAMMED

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is G371371-102?

G371371-102 is a MICROCIRCUIT,MEMORY.

What is the NSN for G371371-102?

G371371-102 is cataloged in the U.S. Government catalog under NSN 5962-01-358-6216. This indicates validated use in U.S. government and defense supply chains.

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