G319124-2 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G319124-2: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include bit_quantity: 16000, word_quantity: 2000, special_features: RAD HARD PER RAYTHEON G371916 ANDANSI Y14.5M-1982, features_provided: ELECTROSTATIC SENSITIVE AND RADIATION HARDENED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-356-9153, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G319124-2

NSN: 5962-01-356-9153
FSC: 5962 — Microcircuits, Electronic
CAGE: 49956 — RAYTHEON COMPANY DIV CORP (USA)

SPECIFICATIONS

bit_quantity	16000
word_quantity	2000
special_features	RAD HARD PER RAYTHEON G371916 ANDANSI Y14.5M-1982
features_provided	ELECTROSTATIC SENSITIVE AND RADIATION HARDENED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	MILSTAR
inclosure_configuration	FLAT PACK
terminal_type_and_quantity	48 FLAT LEADS
NSN	5962-01-356-9153

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 16000

•

WORD QUANTITY: 2000

•

INCLOSURE MATERIAL: CERAMIC

•

CRITICALITY CODE JUSTIFICATION: CBBL AND FEAT AND NHCF

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND RADIATION HARDENED

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: RAM

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	16000
WORD QUANTITY	2000
INCLOSURE MATERIAL	CERAMIC
CRITICALITY CODE JUSTIFICATION	CBBL AND FEAT AND NHCF
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND RADIATION HARDENED
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	RAM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURES	RAD HARD PER RAYTHEON G371916 ANDANSI Y14.5M-1982

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

IDT7132LA90FBRTReference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is G319124-2?

G319124-2 is a MICROCIRCUIT,MEMORY.

What parts can replace G319124-2?

There is 1 known substitute for G319124-2: IDT7132LA90FBRT. Substitute compatibility should be verified for your specific system.

What is the NSN for G319124-2?

G319124-2 is cataloged in the U.S. Government catalog under NSN 5962-01-356-9153. This indicates validated use in U.S. government and defense supply chains.

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