Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: G311480-1

G311480-1 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.540 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.230 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-236-6875, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G311480-1

NSN: 5962-01-236-6875
FSC: 5962
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

body_width	0.510 INCHES MINIMUM AND 0.540 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	1.230 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-236-6875

COMPONENT DIAGRAM

KEY FEATURES

•

TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

•

MEMORY DEVICE TYPE: ROM

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

TIME RATING PER CHACTERISTIC: 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENT	SOLDER
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC	65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
FEATURES PROVIDED	HERMETICALLY SEALED AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 19

G311430-1Interchangeable