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Technical Data Sheet
G311442-1 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMABLE AND BURN IN, memory_device_type: PROM, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., inclosure_configuration: DUAL-IN-LINE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-214-9493, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
G311442-1
NSN: 5962-01-214-9493
FSC: 5962
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)
SPECIFICATIONS
features_providedPROGRAMMABLE AND BURN IN
memory_device_typePROM
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
inclosure_configurationDUAL-IN-LINE
NSN5962-01-214-9493
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN G311442-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE CONFIGURATION: DUAL-IN-LINE
FEATURES PROVIDED: PROGRAMMABLE AND BURN IN
MEMORY DEVICE TYPE: PROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE CONFIGURATIONDUAL-IN-LINE
FEATURES PROVIDEDPROGRAMMABLE AND BURN IN
MEMORY DEVICE TYPEPROM
VERIFIED SUBSTITUTES & CROSS-REFERENCES 17
G286700-1Interchangeable
interchangeable cross-reference
interchangeable
G311428-1Interchangeable
interchangeable cross-reference
interchangeable
G311421-1Interchangeable
interchangeable cross-reference
interchangeable
PRG311421-1Interchangeable
interchangeable cross-reference
interchangeable
G311419-1Interchangeable
interchangeable cross-reference
interchangeable
PRG311439-1Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is G311442-1?
G311442-1 is a MICROCIRCUIT,MEMORY.
What parts can replace G311442-1?
There are 17 known substitutes for G311442-1: G286700-1, G311428-1, G311421-1 and 14 more. Substitute compatibility should be verified for your specific system.
What is the NSN for G311442-1?
G311442-1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-214-9493. This indicates validated use in U.S. government and defense supply chains.
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