G291474-4 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G291474-4: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: MONOLITHIC AND BURN IN AND PROGRAMMED, memory_device_type: PROM, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., end_item_identification: SATELLITE COMMUNICATIONS TERMINAL AN/USC-38(V)1, inclosure_configuration: FLAT PACK, terminal_type_and_quantity: 14 FLAT LEADS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-351-3059, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G291474-4

NSN: 5962-01-351-3059
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

features_provided	MONOLITHIC AND BURN IN AND PROGRAMMED
memory_device_type	PROM
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
end_item_identification	SATELLITE COMMUNICATIONS TERMINAL AN/USC-38(V)1
inclosure_configuration	FLAT PACK
terminal_type_and_quantity	14 FLAT LEADS
part_name_assigned_by_controlling_agency	FUSED PROM
NSN	5962-01-351-3059

COMPONENT DIAGRAM

KEY FEATURES

•

FEATURES PROVIDED: MONOLITHIC AND BURN IN AND PROGRAMMED

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: PROM

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

FEATURES PROVIDED	MONOLITHIC AND BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	PROM
PART NAME ASSIGNED BY CONTROLLING AGENCY	FUSED PROM
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
END ITEM IDENTIFICATION	SATELLITE COMMUNICATIONS TERMINAL AN/USC-38(V)1
TERMINAL TYPE AND QUANTITY	14 FLAT LEADS

SUBSTITUTES & CROSS-REFERENCES 3

PRG291474-4Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

G267037-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Semi-active item — no replacement plannedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is G291474-4?

G291474-4 is a MICROCIRCUIT,MEMORY.

What parts can replace G291474-4?

There are 3 known substitutes for G291474-4: PRG291474-4, ROM/PROM, G267037-1. Substitute compatibility should be verified for your specific system.

What is the NSN for G291474-4?

G291474-4 is cataloged in the U.S. Government catalog under NSN 5962-01-351-3059. This indicates validated use in U.S. government and defense supply chains.

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