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Technical Data Sheet
G286699-1 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.540 INCHES MAXIMUM IN, body_height: 0.220 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-214-8823, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
G286699-1
NSN: 5962-01-214-8823
FSC: 5962
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)
SPECIFICATIONS
body_width0.540 INCHES MAXIMUM IN
body_height0.220 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
NSN5962-01-214-8823
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN G286699-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE CONFIGURATION: DUAL-IN-LINE
MEMORY DEVICE TYPE: PROM
FEATURES PROVIDED: PROGRAMMABLE AND BURN IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROM
FEATURES PROVIDEDPROGRAMMABLE AND BURN IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 1
G311408-1Interchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is G286699-1?
G286699-1 is a MICROCIRCUIT,MEMORY.
What parts can replace G286699-1?
There is 1 known substitute for G286699-1: G311408-1. Substitute compatibility should be verified for your specific system.
What is the NSN for G286699-1?
G286699-1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-214-8823. This indicates validated use in U.S. government and defense supply chains.
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