G282773-852 — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G282773-852: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/ENABLE, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-274-4200, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G282773-852

NSN: 5962-01-274-4200
FSC: 5962 — Microcircuits, Electronic
CAGE: 49956 — RAYTHEON COMPANY DIV CORP (USA)

SPECIFICATIONS

body_width	0.358 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.358 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/ENABLE
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	3 INPUT AND 8 CHANNEL
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-274-4200

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 3 INPUT AND 8 CHANNEL

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 2 MULTIPLEXER/DEMULTIPLEXER, ANALOG

•

BODY WIDTH: 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/ENABLE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	3 INPUT AND 8 CHANNEL
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	2 MULTIPLEXER/DEMULTIPLEXER, ANALOG
BODY WIDTH	0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/ENABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.358 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 5

5962-85131092AReference document

Same NSN cross-reference

Reference document — Secondary reference

10133585Reference document

Same NSN cross-reference

Reference document — Informative reference only

HI4-509A-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

HI4-0509/883Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

HI4-0509A-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is G282773-852?

G282773-852 is a MICROCIRCUIT,LINEAR.

What parts can replace G282773-852?

There are 5 known substitutes for G282773-852: 5962-85131092A, 10133585, HI4-509A-8 and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for G282773-852?

G282773-852 is cataloged in the U.S. Government catalog under NSN 5962-01-274-4200. This indicates validated use in U.S. government and defense supply chains.

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