The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: BURN IN AND BIPOLAR AND LOW POWER AND MONOLITHIC AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-314-3884, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| body_height | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| body_length | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| features_provided | BURN IN AND BIPOLAR AND LOW POWER AND MONOLITHIC AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 4 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-314-3884 |