G268897-308 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G268897-308: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.205 INCHES NOMINAL IN, body_length: 0.970 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 4096, features_provided: HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-214-7380, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G268897-308

NSN: 5962-01-214-7380
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

body_width	0.285 INCHES MAXIMUM IN
body_height	0.205 INCHES NOMINAL IN
body_length	0.970 INCHES MAXIMUM IN
bit_quantity	16384
word_quantity	4096
features_provided	HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-214-7380

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 16384

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

WORD QUANTITY: 4096

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.285 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.205 INCHES NOMINAL IN

•

FEATURES PROVIDED: HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	16384
INPUT CIRCUIT PATTERN	14 INPUT
WORD QUANTITY	4096
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.285 INCHES MAXIMUM IN
BODY HEIGHT	0.205 INCHES NOMINAL IN
FEATURES PROVIDED	HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

AM27S41ADMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is G268897-308?

G268897-308 is a MICROCIRCUIT,MEMORY.

What parts can replace G268897-308?

There are 2 known substitutes for G268897-308: ROM/PROM, AM27S41ADMB. Substitute compatibility should be verified for your specific system.

What is the NSN for G268897-308?

G268897-308 is cataloged in the U.S. Government catalog under NSN 5962-01-214-7380. This indicates validated use in U.S. government and defense supply chains.

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