G268897-306 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G268897-306: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.205 INCHES NOMINAL IN, body_length: 0.970 INCHES MAXIMUM IN, features_provided: HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-214-7379, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G268897-306

NSN: 5962-01-214-7379
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

body_width	0.285 INCHES MAXIMUM IN
body_height	0.205 INCHES NOMINAL IN
body_length	0.970 INCHES MAXIMUM IN
features_provided	HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-214-7379

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.285 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.205 INCHES NOMINAL IN

•

FEATURES PROVIDED: HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.285 INCHES MAXIMUM IN
BODY HEIGHT	0.205 INCHES NOMINAL IN
FEATURES PROVIDED	HIGH SPEED AND SCHOTTKY AND HIGH RELIABILITY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.970 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 085Reference document

Same NSN cross-reference

Reference document — Secondary reference

AM27S41ADMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is G268897-306?

G268897-306 is a MICROCIRCUIT,MEMORY.

What parts can replace G268897-306?

There are 2 known substitutes for G268897-306: ROM/PROM FAMILY 085, AM27S41ADMB. Substitute compatibility should be verified for your specific system.

What is the NSN for G268897-306?

G268897-306 is cataloged in the U.S. Government catalog under NSN 5962-01-214-7379. This indicates validated use in U.S. government and defense supply chains.

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