G202309-852 — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G202309-852: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-314-9700, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G202309-852

NSN: 5962-01-314-9700
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	11 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-314-9700

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 11 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 2 MULTIPLEXER, ANALOG

•

BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	11 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	2 MULTIPLEXER, ANALOG
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510
BODY LENGTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

HI4-509A-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is G202309-852?

G202309-852 is a MICROCIRCUIT,LINEAR.

What parts can replace G202309-852?

There is 1 known substitute for G202309-852: HI4-509A-8. Substitute compatibility should be verified for your specific system.

What is the NSN for G202309-852?

G202309-852 is cataloged in the U.S. Government catalog under NSN 5962-01-314-9700. This indicates validated use in U.S. government and defense supply chains.

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