G202273-853 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G202273-853: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.432 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN, body_height: 0.070 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.432 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-314-6458, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G202273-853

NSN: 5962-01-314-6458
NIINs: 013146458, 014142466, 014142471, 014142478, 014142480, 014142481, 014142486, 014142525, 014142526, 014142531, 014142532, 014142535, 014142536, 014142549, 014142552, 014142559, 014142565
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

body_width	0.432 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN
body_height	0.070 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.432 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN
features_provided	PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-314-6458

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.432 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW POWER AND SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.432 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN
BODY HEIGHT	0.070 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW POWER AND SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.432 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

S82LS181G/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is G202273-853?

G202273-853 is a MICROCIRCUIT,MEMORY.

What parts can replace G202273-853?

There are 2 known substitutes for G202273-853: ROM/PROM, S82LS181G/883B. Substitute compatibility should be verified for your specific system.

What is the NSN for G202273-853?

G202273-853 is cataloged in the U.S. Government catalog under NSN 5962-01-314-6458. This indicates validated use in U.S. government and defense supply chains.

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