G111283-311 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

G111283-311: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 1.050 INCHES MINIMUM AND 1.110 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 512, features_provided: W/ENABLE AND BIPOLAR AND HIGH IMPEDANCE AND ASYNCHRONOUS AND SYNCHRONOUS AND EDGE TRIGGERED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-214-4456, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

G111283-311

NSN: 5962-01-214-4456
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)

SPECIFICATIONS

body_width	0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN
body_height	0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
body_length	1.050 INCHES MINIMUM AND 1.110 INCHES MAXIMUM IN
bit_quantity	4096
word_quantity	512
features_provided	W/ENABLE AND BIPOLAR AND HIGH IMPEDANCE AND ASYNCHRONOUS AND SYNCHRONOUS AND EDGE TRIGGERED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-214-4456

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 4096

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

WORD QUANTITY: 512

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN

•

FEATURES PROVIDED: W/ENABLE AND BIPOLAR AND HIGH IMPEDANCE AND ASYNCHRONOUS AND SYNCHRONOUS AND EDGE TRIGGERED

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	4096
INPUT CIRCUIT PATTERN	12 INPUT
WORD QUANTITY	512
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN
BODY HEIGHT	0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
FEATURES PROVIDED	W/ENABLE AND BIPOLAR AND HIGH IMPEDANCE AND ASYNCHRONOUS AND SYNCHRONOUS AND EDGE TRIGGERED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

AM27S27DM-BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is G111283-311?

G111283-311 is a MICROCIRCUIT,MEMORY.

What parts can replace G111283-311?

There are 2 known substitutes for G111283-311: ROM/PROM, AM27S27DM-B. Substitute compatibility should be verified for your specific system.

What is the NSN for G111283-311?

G111283-311 is cataloged in the U.S. Government catalog under NSN 5962-01-214-4456. This indicates validated use in U.S. government and defense supply chains.

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