G104646-821: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.308 INCHES MAXIMUM IN, body_height: 0.067 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.308 INCHES MAXIMUM IN, features_provided: MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-314-9192, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.308 INCHES MAXIMUM IN |
| body_height | 0.067 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| body_length | 0.308 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 9 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-314-9192 |
| INPUT CIRCUIT PATTERN | 9 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 COUNTER, BINARY |
| BODY WIDTH | 0.308 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.067 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| BODY LENGTH | 0.308 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |