The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include shape: STRAIGHT, diameter: 0.250 INCHES NOMINAL IN, material: SILICON SEMICONDUCTOR, mounting_shank: INCLUDED, overall_length: 0.360 INCHES NOMINAL IN, mounting_method: TERMINAL. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 3455-00-248-4934, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| shape | STRAIGHT |
| diameter | 0.250 INCHES NOMINAL IN |
| material | SILICON SEMICONDUCTOR |
| mounting_shank | INCLUDED |
| overall_length | 0.360 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 0.320 INCHES NOMINAL IN |
| overall_diameter | 0.150 INCHES NOMINAL IN |
| style_designator | CYLINDRICAL SHAPE WITHOUT END CUT |
| features_provided | HERMETICALLY SEALED CASE |
| removability_feature | NOT INCLUDED |
| cutter_tooth_cut_style | MEDIUM |
| NSN | 3455-00-248-4934 |
| CUTTER TOOTH STYLE DESIGNATOR | C1 |
| SHAPE | STRAIGHT |
| CUTTING SURFACE LENGTH | 0.500 INCHES NOMINAL IN |
| CUTTER TOOTH CUT STYLE | MEDIUM |
| STYLE DESIGNATOR | CYLINDRICAL SHAPE WITHOUT END CUT |
| CUTTER TOOTH SHAPING METHOD | GROUND FROM SOLID |
| REMOVABILITY FEATURE | NOT INCLUDED |
| OVERALL DIAMETER | 0.125 INCHES NOMINAL IN |
| MOUNTING SHANK | INCLUDED |
| NONDEFINITIVE SPEC/STD DATA | 1 TYPE AND A STYLE AND 5 SIZE AND B CLASS |