FW8519334-106 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

FW8519334-106: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: HONEYWELL CIRCUIT CARD ASSEMBLY, I/O CONTROLLER, INTERFACE (A3A2), inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-449-5368, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

FW8519334-106

NSN: 5962-01-449-5368
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)

SPECIFICATIONS

output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	HONEYWELL CIRCUIT CARD ASSEMBLY, I/O CONTROLLER, INTERFACE (A3A2)
inclosure_configuration	LEADLESS FLAT PACK
terminal_type_and_quantity	28 LEADLESS
voltage_rating_and_type_per_characteristic	5.0 VOLTS MAXIMUM INPUT
NSN	5962-01-449-5368

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: PAL

•

OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM INPUT

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TERMINAL TYPE AND QUANTITY: 28 LEADLESS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	PAL
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS MAXIMUM INPUT
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
END ITEM IDENTIFICATION	HONEYWELL CIRCUIT CARD ASSEMBLY, I/O CONTROLLER, INTERFACE (A3A2)
TERMINAL TYPE AND QUANTITY	28 LEADLESS

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

8521952-102Reference document

Same NSN cross-reference

Reference document — Secondary reference

ATV750-20Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is FW8519334-106?

FW8519334-106 is a MICROCIRCUIT,MEMORY.

What parts can replace FW8519334-106?

There are 3 known substitutes for FW8519334-106: ROM/PROM, 8521952-102, ATV750-20. Substitute compatibility should be verified for your specific system.

What is the NSN for FW8519334-106?

FW8519334-106 is cataloged in the U.S. Government catalog under NSN 5962-01-449-5368. This indicates validated use in U.S. government and defense supply chains.

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FW8519334-106 — MICROCIRCUIT,MEMORY

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