FPQ3467: SEMICONDUCTOR DEVICES,UNITIZED.
The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, overall_width: 0.325 INCHES MAXIMUM IN, overall_height: 0.200 INCHES MAXIMUM IN, overall_length: 0.785 INCHES MAXIMUM IN, transfer_ratio: 20.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER ALL TRANSISTOR, mounting_method: PRESS FIT. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-153-2338, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| overall_width | 0.325 INCHES MAXIMUM IN |
| overall_height | 0.200 INCHES MAXIMUM IN |
| overall_length | 0.785 INCHES MAXIMUM IN |
| transfer_ratio | 20.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER ALL TRANSISTOR |
| mounting_method | PRESS FIT |
| special_features | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: PNP |
| features_provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE |
| semiconductor_material | SILICON ALL TRANSISTOR |
| terminal_type_and_quantity | 14 UNINSULATED WIRE LEAD |
| component_name_and_quantity | 4 TRANSISTOR |
| power_rating_per_characteristic | 6.3 WATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL TRANSISTOR |
| NSN | 5961-01-153-2338 |