FP6101 — ADHESIVE

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

FP6101: ADHESIVE.

The ADHESIVE is a the manufacturer industrial component. Key specifications include material: PLASTIC EPOXY, curing_method: HEAT, physical_form: PASTE, features_provided: SEPARATE CATALYST, specific_usage_design: FOR UNDERFILLING CHIP SCALE PACKAGES (CSPS) AND BALL GRID ARRAYS (BGAS) ON CIRCUIT BOARDS, supplementary_features: 10 MILLILITER SYRINGE. This part is cataloged in the U.S.

Government catalog under NSN 8040-01-603-7992, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

FP6101

NSN: 8040-01-603-7992
FSC: 8040 — Adhesives
CAGE: 04347 — HENKEL LOCTITE CORP (USA)

SPECIFICATIONS

material	PLASTIC EPOXY
curing_method	HEAT
physical_form	PASTE
special_features	PREMIXED AND FROZEN; UNFILLED; FLEXIBLE; REMOVABLE; ELEVATED TEMPERATURE CURE, 5 TO 10 MINUTES AT 150 DEG C; MUST BE SHIPPED AND STORED AT MINUS 40 DEG C OR BELOW DEGC
features_provided	SEPARATE CATALYST
specific_usage_design	FOR UNDERFILLING CHIP SCALE PACKAGES (CSPS) AND BALL GRID ARRAYS (BGAS) ON CIRCUIT BOARDS
supplementary_features	10 MILLILITER SYRINGE
quantity_within_each_unit_package	10.000 MILLILITERS
NSN	8040-01-603-7992

COMPONENT DIAGRAM

KEY FEATURES

•

CURING METHOD: HEAT

•

SUPPLEMENTARY FEATURES: 10 MILLILITER SYRINGE

•

FEATURES PROVIDED: SEPARATE CATALYST

•

QUANTITY WITHIN EACH UNIT PACKAGE: 10.000 MILLILITERS

•

PHYSICAL FORM: PASTE

•

COLOR: BLACK

•

SPECIFIC USAGE DESIGN: FOR UNDERFILLING CHIP SCALE PACKAGES (CSPS) AND BALL GRID ARRAYS (BGAS) ON CIRCUIT BOARDS

TECHNICAL CHARACTERISTICS

CURING METHOD	HEAT
SUPPLEMENTARY FEATURES	10 MILLILITER SYRINGE
FEATURES PROVIDED	SEPARATE CATALYST
QUANTITY WITHIN EACH UNIT PACKAGE	10.000 MILLILITERS
PHYSICAL FORM	PASTE
COLOR	BLACK
SPECIAL FEATURES	PREMIXED AND FROZEN; UNFILLED; FLEXIBLE; REMOVABLE; ELEVATED TEMPERATURE CURE, 5 TO 10 MINUTES AT 150 DEG C; MUST BE SHIPPED AND STORED AT MINUS 40 DEG C OR BELOW DEGC
SPECIFIC USAGE DESIGN	FOR UNDERFILLING CHIP SCALE PACKAGES (CSPS) AND BALL GRID ARRAYS (BGAS) ON CIRCUIT BOARDS
MATERIAL	PLASTIC EPOXY

OTHER ITEMS IN FSC 8040 — Adhesives

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

8040-00-004-0837 8040-00-004-2337 8040-00-004-2342 8040-00-004-2344 8040-00-007-2167 8040-00-009-7171 8040-00-010-6622 8040-00-012-0792

SUBSTITUTES & CROSS-REFERENCES 2

506975Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

HYSOL FP6101Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

HAZMAT per U.S. Government catalogShelf-life managedAcquisition advice: Terminal item — stock exhausted; no further procurementNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is FP6101?

FP6101 is a ADHESIVE.

What parts can replace FP6101?

There are 2 known substitutes for FP6101: 506975, HYSOL FP6101. Substitute compatibility should be verified for your specific system.

What is the NSN for FP6101?

FP6101 is cataloged in the U.S. Government catalog under NSN 8040-01-603-7992. This indicates validated use in U.S. government and defense supply chains.

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FP6101 — ADHESIVE

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