SOCKET,PLUG-IN ELECTRONIC COMPON. Key specifications include material: PLASTIC BODY, mounting_method: SADDLE, features_provided: COMPONENT RETAINING DEVICE, surface_treatment: CADMIUM CONTACT, fabrication_method: LAMINATED, terminal_type_and_quantity: 2 TAB, SOLDER LUG. This part is cataloged in the Federal Logistics Information System under NSN 5935-00-885-8598, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC BODY |
| mounting_method | SADDLE |
| features_provided | COMPONENT RETAINING DEVICE |
| surface_treatment | CADMIUM CONTACT |
| fabrication_method | LAMINATED |
| terminal_type_and_quantity | 2 TAB, SOLDER LUG |
| accommodated_contact_quantity | 2 |
| specific_equipment_accommodated | SEMICONDUCTOR |
| mounting_type_for_which_designed | CHASSIS |
| ground_terminal_type_and_quantity | 1 TAB, SOLDER LUG |
| NSN | 5935-00-885-8598 |
| SURFACE TREATMENT | CADMIUM CONTACT |
| MATERIAL | COPPER ALLOY CONTACT |
| ACCOMMODATED CONTACT QUANTITY | 2 |
| FEATURES PROVIDED | COMPONENT RETAINING DEVICE |
| TERMINAL TYPE AND QUANTITY | 2 TAB, SOLDER LUG |
| MATERIAL | PLASTIC BODY |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
| GROUND TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR |
| FABRICATION METHOD | LAMINATED |