The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.205 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.100 INCHES MINIMUM IN, overall_diameter: 0.107 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-425-8964, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.205 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.100 INCHES MINIMUM IN |
| overall_diameter | 0.107 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| voltage_rating_in_volts_per_characteristic | 300.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 175.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-00-425-8964 |
| OVERALL LENGTH | 0.205 INCHES MAXIMUM IN |
| OVERALL DIAMETER | 0.107 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.100 INCHES MINIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS JUNCTION DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | TERMINAL |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 300.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MATERIAL | GLASS ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |