The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.310 INCHES MAXIMUM IN, overall_height: 0.200 INCHES MAXIMUM IN, overall_length: 0.465 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.200 INCHES MINIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-762-8505, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.310 INCHES MAXIMUM IN |
| overall_height | 0.200 INCHES MAXIMUM IN |
| overall_length | 0.465 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.200 INCHES MINIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| semiconductor_material | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| terminal_type_and_quantity | 4 UNINSULATED WIRE LEAD |
| component_name_and_quantity | 2 SEMICONDUCTOR DEVICE DIODE |
| component_function_relationship | MATCHED |
| current_rating_per_characteristic | 600.00 MILLIAMPERES MAXIMUM PEAK FORWARD SURGE CURRENT ALL SEMICONDUCTOR DEVICE DIODE |
| NSN | 5961-00-762-8505 |
| OVERALL WIDTH | 0.310 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.200 INCHES MINIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL LENGTH | 0.465 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| OVERALL HEIGHT | 0.200 INCHES MAXIMUM IN |
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS AMBIENT AIR DEGC |
| CURRENT RATING PER CHARACTERISTIC | 600.00 MILLIAMPERES MAXIMUM PEAK FORWARD SURGE CURRENT ALL SEMICONDUCTOR DEVICE DIODE |