The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.250 INCHES NOMINAL IN, body_length: 0.750 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC, inclosure_material: SILICON, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-066-7357, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.250 INCHES NOMINAL IN |
| body_length | 0.750 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC |
| inclosure_material | SILICON |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| design_function_and_quantity | 6 BUFFER |
| maximum_power_dissipation_rating | 200.0 MILLIWATTS |
| NSN | 5962-01-066-7357 |
| DESIGN FUNCTION AND QUANTITY | 6 BUFFER |
| INCLOSURE MATERIAL | SILICON |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY LENGTH | 0.750 INCHES NOMINAL IN |
| BODY WIDTH | 0.250 INCHES NOMINAL IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |