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F10415ADC — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

F10415ADC: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC, output_logic_form: EMITTER-COUPLED LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-132-0144, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
F10415ADC
NSN: 5962-01-132-0144
FSC: 5962 — Microcircuits, Electronic
CAGE: 07263 — FAIRCHILD SEMICONDUCTOR CORP (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC
output_logic_formEMITTER-COUPLED LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
end_item_identificationB-52G/H WST 36378 G
NSN5962-01-132-0144
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN F10415ADC MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 13 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN13 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
BODY LENGTH0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 5
406131Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
91510425Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
4014115-01Reference document
Same NSN cross-reference
Reference document — Secondary reference
DM10415AJReference document
Same NSN cross-reference
Reference document — Secondary reference
10415DC10Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is F10415ADC?
F10415ADC is a MICROCIRCUIT,MEMORY.
What parts can replace F10415ADC?
There are 5 known substitutes for F10415ADC: 406131, 91510425, 4014115-01 and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for F10415ADC?
F10415ADC is cataloged in the U.S. Government catalog under NSN 5962-01-132-0144. This indicates validated use in U.S. government and defense supply chains.
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