The CIRCUIT CARD ASSEMBLY is a the manufacturer industrial component. Key specifications include material: PLASTIC EPOXY, physical_form: PASTE, special_features: SERVICE TEMPERATURE RANGE OF MINUS 40 DEG F TO PLUS 200 DEG F DEGF, features_provided: SEPARATE CATALYST, specific_usage_design: FOR GENERAL PURPOSE RAPID BONDING OF METALS, FABRICS, CERAMICS, GLASS, WOOD AND CONCRETE, supplementary_features: 25 MILLILITER TUBE KIT. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 8040-01-034-0401, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC EPOXY |
| physical_form | PASTE |
| special_features | SERVICE TEMPERATURE RANGE OF MINUS 40 DEG F TO PLUS 200 DEG F DEGF |
| features_provided | SEPARATE CATALYST |
| specific_usage_design | FOR GENERAL PURPOSE RAPID BONDING OF METALS, FABRICS, CERAMICS, GLASS, WOOD AND CONCRETE |
| supplementary_features | 25 MILLILITER TUBE KIT |
| quantity_within_each_unit_package | 25.000 MILLILITERS |
| NSN | 8040-01-034-0401 |
| SUPPLEMENTARY FEATURES | 25 MILLILITER TUBE KIT |
| COLOR | CLEAR |
| PHYSICAL FORM | PASTE |
| SPECIFIC USAGE DESIGN | FOR GENERAL PURPOSE RAPID BONDING OF METALS, FABRICS, CERAMICS, GLASS, WOOD AND CONCRETE |
| QUANTITY WITHIN EACH UNIT PACKAGE | 25.000 MILLILITERS |
| SPECIAL FEATURES | SERVICE TEMPERATURE RANGE OF MINUS 40 DEG F TO PLUS 200 DEG F DEGF |
| FEATURES PROVIDED | SEPARATE CATALYST |
| MATERIAL | PLASTIC EPOXY |