The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: ACTUAL, features_provided: PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-394-4646, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| special_features | ACTUAL |
| features_provided | PROGRAMMABLE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | PIN GRID ARRAY |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 196 PIN |
| time_rating_per_chacteristic | 6.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS |
| maximum_power_dissipation_rating | 500.0 MILLIWATTS |
| NSN | 5962-01-394-4646 |
| SPECIAL FEATURES | ACTUAL |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| TERMINAL TYPE AND QUANTITY | 196 PIN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| MEMORY DEVICE TYPE | PAL |
| TIME RATING PER CHACTERISTIC | 6.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | PROGRAMMABLE |