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ES5477-04 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

ES5477-04: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-292-8291, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ES5477-04
NSN: 5962-01-292-8291
NIINs: 012928291, 012928292, 012928294, 012928295, 013106970, 013106971
FSC: 5962 — Microcircuits, Electronic
CAGE: 20418 — DRS SUSTAINMENT SYSTEMS, INC. (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
features_providedMONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-292-8291
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ES5477-04 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.205 INCHES NOMINAL IN
•
FEATURES PROVIDED: PROGRAMMABLE AND BIPOLAR AND ELECTROSTATIC SENSITIVE AND W/ENABLE AND EDGE TRIGGERED
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN16 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
BODY HEIGHT0.205 INCHES NOMINAL IN
FEATURES PROVIDEDPROGRAMMABLE AND BIPOLAR AND ELECTROSTATIC SENSITIVE AND W/ENABLE AND EDGE TRIGGERED
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH1.170 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 4
702495-001Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
AM27S45ADMBReference document
Same NSN cross-reference
Reference document — Secondary reference
CY7C245-45DMBReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM FAMILY 116Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation
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FREQUENTLY ASKED QUESTIONS
What is ES5477-04?
ES5477-04 is a MICROCIRCUIT,MEMORY.
What parts can replace ES5477-04?
There are 4 known substitutes for ES5477-04: 702495-001, AM27S45ADMB, CY7C245-45DMB and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for ES5477-04?
ES5477-04 is cataloged in the U.S. Government catalog under NSN 5962-01-292-8291. This indicates validated use in U.S. government and defense supply chains.
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