ES5470-02 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ES5470-02: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.260 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND W/ENABLE AND HERMETICALLY SEALED, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-270-0686, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ES5470-02

NSN: 5962-01-270-0686
FSC: 5962 — Microcircuits, Electronic
CAGE: 20418 — DRS SUSTAINMENT SYSTEMS, INC. (USA)

SPECIFICATIONS

body_width	0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	1.260 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND W/ENABLE AND HERMETICALLY SEALED
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
precious_material	GOLD
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
NSN	5962-01-270-0686

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER OR GOLD

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.210 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND W/ENABLE AND HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER OR GOLD
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.350 INCHES MINIMUM AND 0.390 INCHES MAXIMUM IN
BODY HEIGHT	0.210 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND W/ENABLE AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
CASE OUTLINE SOURCE AND DESIGNATOR	D-7 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 2

CY7C122-35DMBReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

AM9122-35DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is ES5470-02?

ES5470-02 is a MICROCIRCUIT,MEMORY.

What parts can replace ES5470-02?

There are 2 known substitutes for ES5470-02: CY7C122-35DMB, AM9122-35DMB. Substitute compatibility should be verified for your specific system.

What is the NSN for ES5470-02?

ES5470-02 is cataloged in the U.S. Government catalog under NSN 5962-01-270-0686. This indicates validated use in U.S. government and defense supply chains.

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