ES52SPL-70P13 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

ES52SPL-70P13: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 512, features_provided: 3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND PROGRAMMABLE AND BIPOLAR. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-277-9681, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

ES52SPL-70P13

NSN: 5962-01-277-9681
FSC: 5962 — Microcircuits, Electronic
CAGE: 57230 — GOULD INC SIMULATION SYSTEMS DIV (USA)

SPECIFICATIONS

body_width	0.560 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
body_length	1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
bit_quantity	4096
word_quantity	512
features_provided	3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
NSN	5962-01-277-9681

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 4096

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

WORD QUANTITY: 512

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN

•

FEATURES PROVIDED: 3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND PROGRAMMABLE AND BIPOLAR

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	4096
INPUT CIRCUIT PATTERN	12 INPUT
WORD QUANTITY	512
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES MAXIMUM IN
BODY HEIGHT	0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
FEATURES PROVIDED	3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

AM27S15DCReference document

Same NSN cross-reference

Reference document — Secondary reference

N82S115FReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is ES52SPL-70P13?

ES52SPL-70P13 is a MICROCIRCUIT,MEMORY.

What parts can replace ES52SPL-70P13?

There are 3 known substitutes for ES52SPL-70P13: ROM/PROM, AM27S15DC, N82S115F. Substitute compatibility should be verified for your specific system.

What is the NSN for ES52SPL-70P13?

ES52SPL-70P13 is cataloged in the U.S. Government catalog under NSN 5962-01-277-9681. This indicates validated use in U.S. government and defense supply chains.

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