EP76M: ADHESIVE.
The ADHESIVE is a the manufacturer industrial component. Key specifications include material: PLASTIC EPOXY, physical_form: PASTE, special_features: NICKEL FILLED; ELECTRICALLY CONDUCTIVE; STORE AT BELOW 75 DEG F AND TRANSPORT AT AMBIENT TEMPERATURE. DEGF, features_provided: SEPARATE CATALYST, specific_usage_design: FOR ELECTRONICS BONDING APPLICATIONS, supplementary_features: 1 PINT KIT.
This part is cataloged in the U.S. Government catalog under NSN 8040-01-508-6576, indicating validated use in U.S. government and defense logistics supply chains.
Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC EPOXY |
| physical_form | PASTE |
| special_features | NICKEL FILLED; ELECTRICALLY CONDUCTIVE; STORE AT BELOW 75 DEG F AND TRANSPORT AT AMBIENT TEMPERATURE. DEGF |
| features_provided | SEPARATE CATALYST |
| specific_usage_design | FOR ELECTRONICS BONDING APPLICATIONS |
| supplementary_features | 1 PINT KIT |
| quantity_within_each_unit_package | 1.000 PINTS |
| NSN | 8040-01-508-6576 |
| SUPPLEMENTARY FEATURES | 1 PINT KIT |
| FEATURES PROVIDED | SEPARATE CATALYST |
| QUANTITY WITHIN EACH UNIT PACKAGE | 1.000 PINTS |
| PHYSICAL FORM | PASTE |
| COLOR | GRAY/GREY |
| SPECIAL FEATURES | NICKEL FILLED; ELECTRICALLY CONDUCTIVE; STORE AT BELOW 75 DEG F AND TRANSPORT AT AMBIENT TEMPERATURE. DEGF |
| SPECIFIC USAGE DESIGN | FOR ELECTRONICS BONDING APPLICATIONS |
| MATERIAL | PLASTIC EPOXY |
No substitute or cross-reference records for this part.