EP174: RELAY,SOLID STATE.
The RELAY,SOLID STATE is a the manufacturer solid-state storage device designed for enterprise environments demanding consistent performance and data integrity. Key specifications include overall_width: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, overall_height: 0.170 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN, overall_length: 0.405 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, internal_configuration: JUNCTION CONTACT, semiconductor_material: SILICON. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-149-9257, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN |
| overall_height | 0.170 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN |
| overall_length | 0.405 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| terminal_type_and_quantity | 3 UNINSULATED WIRE LEAD |
| electrode_internally-electrically_connected_to_case | COLLECTOR |
| NSN | 5961-00-149-9257 |
| OVERALL HEIGHT | 0.185 INCHES MAXIMUM IN |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 0.620 INCHES MAXIMUM IN |
| OVERALL WIDTH | 0.620 INCHES MAXIMUM IN |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |