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EP174 — RELAY,SOLID STATE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

EP174: RELAY,SOLID STATE.

The RELAY,SOLID STATE is a the manufacturer solid-state storage device designed for enterprise environments demanding consistent performance and data integrity. Key specifications include overall_width: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, overall_height: 0.170 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN, overall_length: 0.405 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, internal_configuration: JUNCTION CONTACT, semiconductor_material: SILICON. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-149-9257, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
EP174
NSN: 5961-00-149-9257
NIINs: 001499257, 004930449, 011225176
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)
SPECIFICATIONS
overall_width0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
overall_height0.170 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN
overall_length0.405 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED CASE
internal_configurationJUNCTION CONTACT
semiconductor_materialSILICON
terminal_type_and_quantity3 UNINSULATED WIRE LEAD
electrode_internally-electrically_connected_to_caseCOLLECTOR
NSN5961-00-149-9257
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN EP174 MFR OEM RELAY,SOLID STATE
KEY FEATURES
•
SEMICONDUCTOR MATERIAL: SILICON
•
TERMINAL TYPE AND QUANTITY: 3 UNINSULATED WIRE LEAD
TYPICAL APPLICATIONS
  • Enterprise storage arrays and SANs
  • Direct-attached storage (DAS) expansion
  • Database tier storage (OLTP, OLAP)
  • Virtual machine datastore expansion
  • Backup-to-disk and disaster recovery targets
  • Content delivery and media streaming storage
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.185 INCHES MAXIMUM IN
SEMICONDUCTOR MATERIALSILICON
OVERALL LENGTH0.620 INCHES MAXIMUM IN
OVERALL WIDTH0.620 INCHES MAXIMUM IN
SPECIAL FEATURESJUNCTION PATTERN ARRANGEMENT: NPN
TERMINAL TYPE AND QUANTITY3 UNINSULATED WIRE LEAD
SUBSTITUTES & CROSS-REFERENCES 3
TIP35Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
101000106Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
4902-00-0350Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is EP174?
EP174 is a RELAY,SOLID STATE.
What parts can replace EP174?
There are 3 known substitutes for EP174: TIP35, 101000106, 4902-00-0350. Substitute compatibility should be verified for your specific system.
What is the NSN for EP174?
EP174 is cataloged in the U.S. Government catalog under NSN 5961-00-149-9257. This indicates validated use in U.S. government and defense supply chains.
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