EDRC-L-3 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

EDRC-L-3: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 2.610 INCHES MINIMUM AND 2.640 INCHES MAXIMUM IN, body_height: 0.520 INCHES MAXIMUM IN, body_length: 3.110 INCHES MINIMUM AND 3.140 INCHES MAXIMUM IN, overall_height: 0.770 INCHES MAXIMUM IN, features_provided: W/CURRENT LIMITER AND W/HEAT SINK AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-219-4443, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

EDRC-L-3

NSN: 5962-01-219-4443
FSC: 5962 — Microcircuits, Electronic
CAGE: 19645 — DATA DEVICE CORP DBA BETA TRANSFORMER TECHNOLOGY (USA)

SPECIFICATIONS

body_width	2.610 INCHES MINIMUM AND 2.640 INCHES MAXIMUM IN
body_height	0.520 INCHES MAXIMUM IN
body_length	3.110 INCHES MINIMUM AND 3.140 INCHES MAXIMUM IN
overall_height	0.770 INCHES MAXIMUM IN
features_provided	W/CURRENT LIMITER AND W/HEAT SINK AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	METAL AND PLASTIC
storage_temp_range	-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	18 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-219-4443

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 18 INPUT

•

INCLOSURE MATERIAL: METAL AND PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 2.610 INCHES MINIMUM AND 2.640 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.520 INCHES MAXIMUM IN

•

FEATURES PROVIDED: W/CURRENT LIMITER AND W/HEAT SINK AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.770 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	18 INPUT
INCLOSURE MATERIAL	METAL AND PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	2.610 INCHES MINIMUM AND 2.640 INCHES MAXIMUM IN
BODY HEIGHT	0.520 INCHES MAXIMUM IN
FEATURES PROVIDED	W/CURRENT LIMITER AND W/HEAT SINK AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	3.110 INCHES MINIMUM AND 3.140 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

DRC5114-1421SSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

DRC644-L-3Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is EDRC-L-3?

EDRC-L-3 is a MICROCIRCUIT,MEMORY.

What parts can replace EDRC-L-3?

There are 2 known substitutes for EDRC-L-3: DRC5114-1421S, DRC644-L-3. Substitute compatibility should be verified for your specific system.

What is the NSN for EDRC-L-3?

EDRC-L-3 is cataloged in the U.S. Government catalog under NSN 5962-01-219-4443. This indicates validated use in U.S. government and defense supply chains.

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EDRC-L-3 — MICROCIRCUIT,MEMORY

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