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EDI8833LP70CB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

EDI8833LP70CB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-303-8895, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
EDI8833LP70CB
NSN: 5962-01-303-8895
FSC: 5962 — Microcircuits, Electronic
CAGE: 66301 — WHITE ELECTRONIC DESIGNS CORP DIV COMMERCIAL DIVISION (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND LOW POWER
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern26 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-303-8895
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN EDI8833LP70CB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 26 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND LOW POWER
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-10 MIL-M-38510
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN26 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND LOW POWER
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
BODY LENGTH1.490 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 6
5962-8855202XXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-88552Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-8855202XASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-8855202XBReference document
Same NSN cross-reference
Reference document — Secondary reference
IDT71256L70DBReference document
Same NSN cross-reference
Reference document — Secondary reference
MC51256L-70/BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is EDI8833LP70CB?
EDI8833LP70CB is a MICROCIRCUIT,MEMORY.
What parts can replace EDI8833LP70CB?
There are 6 known substitutes for EDI8833LP70CB: 5962-8855202XX, 5962-88552, 5962-8855202XA and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for EDI8833LP70CB?
EDI8833LP70CB is cataloged in the U.S. Government catalog under NSN 5962-01-303-8895. This indicates validated use in U.S. government and defense supply chains.
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