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EDI88130LPX55CB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

EDI88130LPX55CB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.605 INCHES MAXIMUM IN, body_height: 0.129 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN, body_length: 1.580 INCHES MINIMUM AND 1.700 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN, MIL-STD-883, CLASS B, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC OR GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-370-8088, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
EDI88130LPX55CB
NSN: 5962-01-370-8088
FSC: 5962 — Microcircuits, Electronic
CAGE: 66301 — WHITE ELECTRONIC DESIGNS CORP DIV COMMERCIAL DIVISION (USA)
SPECIFICATIONS
body_width0.580 INCHES MINIMUM AND 0.605 INCHES MAXIMUM IN
body_height0.129 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN
body_length1.580 INCHES MINIMUM AND 1.700 INCHES MAXIMUM IN
features_providedMONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN, MIL-STD-883, CLASS B
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC OR GLASS
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_typeMONOLITHIC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-370-8088
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN EDI88130LPX55CB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
HYBRID TECHNOLOGY TYPE: MONOLITHIC
•
INCLOSURE MATERIAL: CERAMIC OR GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.580 INCHES MINIMUM AND 0.605 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.129 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN, MIL-STD-883, CLASS B
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
HYBRID TECHNOLOGY TYPEMONOLITHIC
INCLOSURE MATERIALCERAMIC OR GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.580 INCHES MINIMUM AND 0.605 INCHES MAXIMUM IN
BODY HEIGHT0.129 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN, MIL-STD-883, CLASS B
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
SPECIFICATION/STANDARD DATA67268-5962-89598 GOVERNMENT STANDARD
BODY LENGTH1.580 INCHES MINIMUM AND 1.700 INCHES MAXIMUM IN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 8
5962-8959817MXXReference document
Same NSN cross-reference
Reference document — Secondary reference
77092290Reference document
Same NSN cross-reference
Reference document — Secondary reference
MSM8128SLMC-55Reference document
Same NSN cross-reference
Reference document — Secondary reference
PDM41024L55CBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8959817MXBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8959817MXASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is EDI88130LPX55CB?
EDI88130LPX55CB is a MICROCIRCUIT,MEMORY.
What parts can replace EDI88130LPX55CB?
There are 8 known substitutes for EDI88130LPX55CB: 5962-8959817MXX, 77092290, MSM8128SLMC-55 and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for EDI88130LPX55CB?
EDI88130LPX55CB is cataloged in the U.S. Government catalog under NSN 5962-01-370-8088. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.