E2160Z1EB1A: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 2.000 INCHES NOMINAL IN, overall_height: 2.000 INCHES NOMINAL IN, overall_length: 8.750 INCHES NOMINAL IN, major_components: DIODE 6; HEAT SINK 6. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-181-8935, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 2.000 INCHES NOMINAL IN |
| overall_height | 2.000 INCHES NOMINAL IN |
| overall_length | 8.750 INCHES NOMINAL IN |
| major_components | DIODE 6; HEAT SINK 6 |
| NSN | 5961-01-181-8935 |
| OVERALL HEIGHT | 2.000 INCHES NOMINAL IN |
| MAJOR COMPONENTS | DIODE 6; HEAT SINK 6 |
| OVERALL LENGTH | 8.750 INCHES NOMINAL IN |
| OVERALL WIDTH | 2.000 INCHES NOMINAL IN |
No substitute or cross-reference records for this part.