DS96F175MJ/883: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 5.59 MILLIMETERS MINIMUM AND 7.87 MILLIMETERS MAXIMUM MM, body_height: 3.56 MILLIMETERS MAXIMUM MM, body_length: 21.34 MILLIMETERS MAXIMUM MM, features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-408-2944, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 5.59 MILLIMETERS MINIMUM AND 7.87 MILLIMETERS MAXIMUM MM |
| body_height | 3.56 MILLIMETERS MAXIMUM MM |
| body_length | 21.34 MILLIMETERS MAXIMUM MM |
| features_provided | ELECTROSTATIC SENSITIVE |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 4 RECEIVER, LINE DIFFERENTIAL |
| maximum_power_dissipation_rating | 1375.0 MILLIWATTS |
| NSN | 5962-01-408-2944 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 4 RECEIVER, LINE DIFFERENTIAL |
| BODY WIDTH | 5.59 MILLIMETERS MINIMUM AND 7.87 MILLIMETERS MAXIMUM MM |
| BODY HEIGHT | 3.56 MILLIMETERS MAXIMUM MM |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES MAXIMUM SUPPLY |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| BODY LENGTH | 21.34 MILLIMETERS MAXIMUM MM |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |