DS55494W: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.375 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND W/ENABLE AND LOW VOLTAGE AND LOW POWER AND HIGH GAIN, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-115-4027, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.300 INCHES MAXIMUM IN |
| body_height | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN |
| body_length | 0.375 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND W/ENABLE AND LOW VOLTAGE AND LOW POWER AND HIGH GAIN |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 7 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-115-4027 |
| INPUT CIRCUIT PATTERN | 7 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY WIDTH | 0.300 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND W/ENABLE AND LOW VOLTAGE AND LOW POWER AND HIGH GAIN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.375 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.