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PartsTable / COMPONENT / DS1973-F5
DS1973-F5 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include memory_capacity: 4096, memory_device_type: EEPROM, operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC, body_outside_diameter: 17.35 MILLIMETERS NOMINAL MM, terminal_type_and_quantity: 1 BONDING PAD. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-519-5674, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
DS1973-F5
NSN: 5962-01-519-5674
FSC: 5962
CAGE: 1ES66 — MAXIM INTEGRATED PRODUCTS, INC. (USA)
SPECIFICATIONS
memory_capacity4096
memory_device_typeEEPROM
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
body_outside_diameter17.35 MILLIMETERS NOMINAL MM
terminal_type_and_quantity1 BONDING PAD
NSN5962-01-519-5674
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN DS1973-F5 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MEMORY CAPACITY: 4096
•
BODY OUTSIDE DIAMETER: 17.35 MILLIMETERS NOMINAL MM
•
MEMORY DEVICE TYPE: EEPROM
•
OPERATING TEMP RANGE: -40.0 TO 85.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 1 BONDING PAD
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY CAPACITY4096
BODY OUTSIDE DIAMETER17.35 MILLIMETERS NOMINAL MM
MEMORY DEVICE TYPEEEPROM
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY1 BONDING PAD
VERIFIED SUBSTITUTES & CROSS-REFERENCES 9
359133Interchangeable
interchangeable cross-reference
interchangeable
050200Interchangeable
interchangeable cross-reference
interchangeable
800605Interchangeable
interchangeable cross-reference
interchangeable
7920NCM050208Interchangeable
interchangeable cross-reference
interchangeable
6515NCM082490Interchangeable
interchangeable cross-reference
interchangeable
7109Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is DS1973-F5?
DS1973-F5 is a MICROCIRCUIT,MEMORY.
What parts can replace DS1973-F5?
There are 9 known substitutes for DS1973-F5: 359133, 050200, 800605 and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for DS1973-F5?
DS1973-F5 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-519-5674. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026