DS1230Y150 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

DS1230Y150: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.720 INCHES MINIMUM AND 0.740 INCHES MAXIMUM IN, body_height: 0.355 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN, body_length: 1.480 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN, special_features: BATTERY-BACKED; 3-STATE OUTPUT; CMOS TECHNOLOGY; THROUGH-HOLE MOUNTING, features_provided: LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-522-3358, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

DS1230Y150

NSN: 5962-01-522-3358
FSC: 5962 — Microcircuits, Electronic
CAGE: 0B0A9 — DALLAS SEMICONDUCTOR CORPORATION DBA MAXIM DALLAS DIRECT (USA)

SPECIFICATIONS

body_width	0.720 INCHES MINIMUM AND 0.740 INCHES MAXIMUM IN
body_height	0.355 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN
body_length	1.480 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN
special_features	BATTERY-BACKED; 3-STATE OUTPUT; CMOS TECHNOLOGY; THROUGH-HOLE MOUNTING
features_provided	LOW POWER
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-40.0 TO 70.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
end_item_identification	LONG RANGE RADAR
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-522-3358

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: PLASTIC

•

BODY WIDTH: 0.720 INCHES MINIMUM AND 0.740 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.355 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW POWER

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 1.480 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN

•

STORAGE TEMP RANGE: -40.0 TO 70.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	PLASTIC
BODY WIDTH	0.720 INCHES MINIMUM AND 0.740 INCHES MAXIMUM IN
BODY HEIGHT	0.355 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.480 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-40.0 TO 70.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURES	BATTERY-BACKED; 3-STATE OUTPUT; CMOS TECHNOLOGY; THROUGH-HOLE MOUNTING

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is DS1230Y150?

DS1230Y150 is a MICROCIRCUIT,MEMORY.

What is the NSN for DS1230Y150?

DS1230Y150 is cataloged in the U.S. Government catalog under NSN 5962-01-522-3358. This indicates validated use in U.S. government and defense supply chains.

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DS1230Y150 — MICROCIRCUIT,MEMORY

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