The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, overall_width: 0.300 INCHES NOMINAL IN, overall_height: 0.200 INCHES MAXIMUM IN, overall_length: 0.785 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.130 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-106-4298, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| overall_width | 0.300 INCHES NOMINAL IN |
| overall_height | 0.200 INCHES MAXIMUM IN |
| overall_length | 0.785 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.130 INCHES NOMINAL IN |
| overall_diameter | 0.219 INCHES NOMINAL IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | FIELD EFFECT-DUAL GATE |
| semiconductor_material | SILICON ALL TRANSISTOR |
| terminal_circle_diameter | 0.100 INCHES NOMINAL IN |
| NSN | 5961-00-106-4298 |
| OVERALL LENGTH | 0.205 INCHES MAXIMUM IN |
| SEMICONDUCTOR MATERIAL | SILICON |
| MOUNTING METHOD | TERMINAL |
| POWER RATING PER CHARACTERISTIC | 350.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| OVERALL WIDTH | 0.165 INCHES MAXIMUM IN |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| TERMINAL CIRCLE DIAMETER | 0.135 INCHES MINIMUM IN |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC |
| OVERALL HEIGHT | 0.210 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 0.500 INCHES MINIMUM IN |