DMS 91131B: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, precious_material: GOLD, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-192-3186, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND EDGE TRIGGERED AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND RESETTABLE AND RETRIGGERABLE AND W/OPEN COLLECTOR |
| precious_material | GOLD |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-192-3186 |
| INPUT CIRCUIT PATTERN | 4 INPUT |
| INCLOSURE MATERIAL | GLASS AND METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| PRECIOUS MATERIAL | GOLD |
| BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 COMPARATOR, VOLTAGE, DIFFERENTIAL |
| BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/STROBE AND HIGH SPEED |
| INCLOSURE CONFIGURATION | CAN |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |