The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.790 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 1024, memory_capacity: UNKNOWN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-01-165-5442, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| body_length | 0.750 INCHES MINIMUM AND 0.790 INCHES MAXIMUM IN |
| bit_quantity | 4096 |
| word_quantity | 1024 |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| NSN | 5962-01-165-5442 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| MEMORY DEVICE TYPE | RAM |
| TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| MEMORY CAPACITY | UNKNOWN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | 13 INPUT |