DMS 89130B: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.850 INCHES MAXIMUM IN, body_height: 0.270 INCHES MAXIMUM IN, body_length: 1.370 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND W/INHIBIT AND W/RESISTOR AND BURN IN, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND METAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-131-8099, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.850 INCHES MAXIMUM IN |
| body_height | 0.270 INCHES MAXIMUM IN |
| body_length | 1.370 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND W/INHIBIT AND W/RESISTOR AND BURN IN |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND METAL |
| memory_device_type | DIODE MATRIX |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| end_item_identification | FLIGHT SET 76301 |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-131-8099 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.850 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.270 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND W/INHIBIT AND W/RESISTOR AND BURN IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| BODY LENGTH | 1.370 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS DEGC |