The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.280 INCHES MAXIMUM IN, special_features: ENVELOPE MATERIAL: GLASS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5960-00-156-4437, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.280 INCHES MAXIMUM IN |
| special_features | ENVELOPE MATERIAL: GLASS |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND HIGH SPEED AND W/ENABLE AND PRESETTABLE AND W/CLEAR |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 9 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5960-00-156-4437 |
| SPECIAL FEATURES | ENVELOPE MATERIAL: GLASS |