The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: SILICON, overall_width: 0.240 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN, overall_height: 0.090 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN, overall_length: 0.170 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.500 INCHES MINIMUM AND 0.750 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-011-1609, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON |
| overall_width | 0.240 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN |
| overall_height | 0.090 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN |
| overall_length | 0.170 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.500 INCHES MINIMUM AND 0.750 INCHES MAXIMUM IN |
| overall_diameter | 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: PNP |
| features_provided | HERMETICALLY SEALED CASE |
| precious_material | GOLD |
| operating_temp_range | -50.0 TO 175.0 CELSIUS DEGC |
| internal_configuration | JUNCTION CONTACT |
| NSN | 5961-00-011-1609 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| SEMICONDUCTOR MATERIAL | SILICON |