DM7514J/883C — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

DM7514J/883C: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 0.815 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-070-7534, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

DM7514J/883C

NSN: 5962-01-070-7534
FSC: 5962 — Microcircuits, Electronic
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES NOMINAL IN
body_length	0.815 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC OR GLASS OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-070-7534

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR GLASS OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC OR GLASS OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.815 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

247ASC2520-035Reference document

Same NSN cross-reference

Reference document — Secondary reference

HPROM-1-1024-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

TM5623MDE/883CReference document

Same NSN cross-reference

Reference document — Secondary reference

S82S129F/883CReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is DM7514J/883C?

DM7514J/883C is a MICROCIRCUIT,MEMORY.

What parts can replace DM7514J/883C?

There are 4 known substitutes for DM7514J/883C: 247ASC2520-035, HPROM-1-1024-8, TM5623MDE/883C and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for DM7514J/883C?

DM7514J/883C is cataloged in the U.S. Government catalog under NSN 5962-01-070-7534. This indicates validated use in U.S. government and defense supply chains.

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