The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.280 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND EXPANDABLE AND SCHOTTKY AND HIGH SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-142-2393, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.280 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND EXPANDABLE AND SCHOTTKY AND HIGH SPEED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 16 PRINTED CIRCUIT |
| NSN | 5962-01-142-2393 |
| MAXIMUM POWER DISSIPATION RATING | 245.0 MILLIWATTS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND EXPANDABLE AND SCHOTTKY AND HIGH SPEED |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| BODY LENGTH | 0.785 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY HEIGHT | 0.180 INCHES MAXIMUM IN |
| BODY WIDTH | 0.280 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| DESIGN FUNCTION AND QUANTITY | 1 DECODER |